ISL98608IIH

FN8724 Rev.2.01

Page 4 of 33

Dec 7, 2021

Application Circuit Diagram

VN

PGND

LXP

VBST

VBSTCP

AGND

ENN

VP

CP

VIN

SDA

SCL

PGNDCP

ENP

VSUB

CN

A

B

C

D

1

23

4

L1

2.2µH OR 4.7µH

CVIN

4.7µF/10V/0603

OR

10µF/10V/0402

CCP-CN

4.7µF/10V/0603

OR

10µF/10V/0402

CVBST

4.7µF/10V/0603

OR

10µF/10V/0402

PROCESSOR

VIN

VIN

CVP

4.7µF/10V/0603

OR

10µF/10V/0402

CVN

4.7µF/10V/0603

OR

10µF/10V/0402

Ordering Information

PART NUMBER

(Notes 2, 3)

PART

MARKING

PACKAGE DESCRIPTION

(RoHS Compliant)

PKG.

DWG. #

CARRIER TYPE

(Note 1)TEMP RANGE

ISL98608IIHZ-T

608H

16 Ball (4x4 bump, 0.4mm pitch) WLCSP

W4x4.16G

Reel, 3k

-40 to +85°C

ISL98608HEVAL1Z

Evaluation Board

NOTES:

1. See TB347 for details on reel specifications.

2. These Pb-free WLCSP packaged products employ special Pb-free material sets; molding compounds/die attach materials and SnAgCu - e1 solder ball

terminals, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Pb-free WLCSP packaged products are MSL

classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

3. For Moisture Sensitivity Level (MSL), see the ISL98608IIH product information. For more information on MSL, see TB363.

TABLE 1. KEY DIFFERENCES BETWEEN FAMILY OF PARTS

PART NUMBER

VIN

(V)

MAXIMUM OUTPUT CURRENT (mA)

VBST VOLTAGE

(V)

VP VOLTAGE

(V)

VN VOLTAGE

(V)

ISL98608

2.5 to 5

100

5.65

5.5

-5.5

ISL98608IIH

2.5 to 5.5

200

5.4

5

-5