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101 데이터시트(PDF) 1 Page - Stannol GmbH & Co KG |
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101 데이터시트(HTML) 1 Page - Stannol GmbH & Co KG |
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1 / 2 page ![]() TECHNICAL DATA SHEET FLUX I 101 Halogen and rosin free flux STANNOL GmbH & Co. KG • TDB_I 101_EN • Stand: 20.03.2026 Haberstr. 24 • 42551 Velbert • Tel: +49 (0)2051-3120-0 • Fax: +49 (0)2051-3120-111 • E-Mail: info@stannol.de • www.stannol.de 1 PRODUCT DESCRIPTION I 101is a halogen free flux to be used in the assembly of electronic compounds. This flux will provide excellent results. I 101 is based on a newly formulated carrier system which does not leave corrosive or conductive residues on the surface after soldering. Based on the proprietary chemistry extreme good results are obtained in regard to surface insulation resistivity. For high integration of electronic compounds I 101 will provide all the characteristics which are described in the test procedure of the DIN EN 29454-1. In addition much higher surface resistivity is achieved when tested at high humidity, what allows using this flux for the most sophisticated electronic applications. PRODUCT PROPERTIES • rosin free • No-Clean • Spraying and foaming • halogen free • good wetting In accordance with: DIN EN 29454-1: 2.1.3.A ANSI J-STD–004: OR L0 APPLICATION I 101 is suitable for the assembly of electronic device for OEM, communication, military, air- and space Electronics. It can be used also for consumer electronics. The exceptional properties can be used to optimize SMD assembly. PROCESSING PROPERTIES I 101 is suitable for all types of soldering equipment. The flux can be applicate by foaming and any other way like spraying. When applied by foaming dry foam with small bubbles will be generated. This leads to excellent wetting of the surface. PROCESSING PARAMETERS - RECOMMENDATION Preheating: ca. 80 - 110 °C PCB top side Amount of flux: ca. 25 – 30 ml / min Transportation speed: ca. 0,8 – 1,2 m / min Solder bath temperature: ca. 260 – 265 °C CLEANING Because the PCB surfaces are generally residue-free after soldering when using the I 101 flux cleaning is not required after soldering. There are some specifications calling for cleaning. In such cases the use of cleaners is recommended. The cleaners remove all residues and provide a clean surface. In addition a high SIR-value will be the result of the cleaning process. |
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