STP16DP05

Package mechanical data

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Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

Table 14.

QSOP-24 mechanical data

Dim.

mm.

inch

Min

Typ

Max

Min

Typ

Max

A

1.54

1.62

1.73

0.061

0.064

0.068

A1

0.1

0.15

0.25

0.004

0.006

0.010

A2

1.47

0.058

b

0.31

0.2

0.012

0.008

c

0.254

0.17

0.010

0.007

D

8.56

8.66

8.76

0.337

0.341

0.345

E

5.8

6

6.2

0.228

0.236

0.244

E1

3.8

3.91

4.01

0.150

0.154

0.158

e

0.635

0.025

L

0.4

0.635

0.89

0.016

0.025

0.035

h

0.25

0.33

0.41

0.010

0.013

0.016

<

8°

0°