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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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AS1163 데이터시트(PDF) 13 Page - ams-OSRAM AG |
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AS1163 데이터시트(HTML) 13 Page - ams-OSRAM AG |
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13 / 91 page  AS1163 Absolute maximum ratings Datasheet • PUBLIC • Document Feedback DS001075 • v2-00 • 2025-Nov-21 13 / 91 / 4 Absolute maximum ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under “Operating Conditions” is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 3: Absolute maximum ratings of AS1163 Symbol Parameter Min Max Unit Comments Electrical parameters VDD / VGND Supply voltage to ground -0.3 7 V Referenced to GND VIN Input pin voltage to ground -0.3 VDD+0.3 V ISCR Input current (latch-up immunity) ± 100 mA AEC-Q100-004 Continuous power dissipation (TA = 70 °C) PT Continuous power dissipation 600 mW Continuous power dissipation (TA = 125 °C, VOUT = 2.5 V, RTH = 71.6 °C/W) PT Continuous power dissipation 300 mW Electrostatic discharge ESDHBM Electrostatic discharge HBM ± 4 KV AEC-Q100-002 ESDCDM Electrostatic discharge CDM ± 500 V AEC-Q100-011, ±750V for corner pins Temperature ranges and storage conditions TA Operating ambient temperature -40 125 °C TJ Operating junction temperature -40 150 °C TSTRG Storage temperature range -55 150 °C TBODY Package body temperature 260 °C IPC/JEDEC J-STD-020(1) RHNC Relative humidity (non- condensing) 5 85 % MSL Moisture sensitivity level 3 ICP/JEDEC J-STD-033 (1) The reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices.” The lead finish for Pb‑free leaded packages is “Matte Tin” (100 % Sn). |
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