BAT41ZFILM datasheet(4/12 Pages) STMICROELECTRONICS

4 / 12 page

Characteristics

BAT41 Series

4/12

Figure 7.

Forward voltage drop versus

forward current (typical values)

Figure 8.

Variation of thermal impedance

junction to ambient versus pulse

duration (printed circuit board,

epoxy FR4, eCU=35 µm, SOT323-6L)

1.E-04

1.E-03

1.E-02

1.E-01

1.E+00

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

(A)

(V)

T =25°C

T =100°C

T =125°C

100

1000

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

(°C/W)

th(j-a)

Single pulse

t(s)

SOT323-6L

Figure 9.

Relative variation of thermal

impedance junction to ambient

versus pulse duration (alumine

substrate, SOT-23) (printed circuit

board, epoxy FR4, eCU=35 µm,

SOD-323)

Figure 10.

Relative variation of thermal

impedance junction to ambient

versus pulse duration (printed

circuit board, epoxy FR4, eCU=35

µm, SOT-666 and SOD-523)

Figure 11.

Thermal resistance junction to

ambient versus copper surface

under each lead (printed circuit

board, epoxy FR4, eCU=35 µm,

SOD-323)

0.01

0.10

1.00

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

Z/R

th(j-a)

t (s)

SOT-23

Alumine substrate

10 x 8 x 0.5 mm

SOD-323

Epoxy FR4

= 2.25 mm

= 35 µm

Single pulse

0.01

0.10

1.00

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

Z/R

th(j-a)

t (s)

SOD-523

Epoxy FR4

= 35 µm

SOT-666

Epoxy FR4

= 35 µm

Single pulse

300

350

400

450

500

550

600

(mm²)

(°C/W)

th(j-a)

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