| 전자부품 데이터시트 검색엔진 |
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LA-G6SP 데이터시트(PDF) 12 Page - ams-OSRAM AG |
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LA-G6SP 데이터시트(HTML) 12 Page - ams-OSRAM AG |
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12 / 21 page ![]() LA G6SP 12 Version 1.6 | 2021-03-15 Recommended Solder Pad 8) Package marking 0.6 (0.024) Lötstopplack Solder resist 0.35 (0.014) A A min 9 mm per anode pad for improved heat dissipation C A A 2 0.8 (0.031) OHLPY925 0.35 (0.014) 0.8 (0.031) Package marking For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. |
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