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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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LA-T676 데이터시트(PDF) 13 Page - ams-OSRAM AG |
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LA-T676 데이터시트(HTML) 13 Page - ams-OSRAM AG |
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13 / 23 page  LA T676 DATASHEET DATASHEET 13 | Version 1.6 | 2023-02-20 Recommended Solder Pad 9) OHLPY970 2.6 (0.102) Cu-area > 16 mm Cu-Fläche > 16 mm 2 2 Solder resist Lötstopplack 2.6 (0.102) Padgeometrie für improved heat dissipation verbesserte Wärmeableitung Paddesign for For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. |
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