STPS3L40 datasheet(3/8 Pages) STMICROELECTRONICS

3 / 8 page

STPS3L40

Characteristics

3/8

Figure 3.

Average forward current versus

ambient temperature (

δ = 0.5)

SMB flat

Figure 4.

Non repetitive surge peak forward

current versus overload duration

(maximum values) SMC

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

100

125

150

(A)

F(AV)

SMB flat

(°C)

amb

=75°C/W

th(j-a)

R=R

th(j-a)

th(j-l)

δ=tp/T

1.E-03

1.E-02

1.E-01

1.E+00

δ=0.5

I (A)

t(s)

T =25°C

T =75°C

T =125°C

SMC

Figure 5.

Non repetitive surge peak forward

current versus overload duration

(maximum values) SMB flat

Figure 6.

Normalized avalanche power

derating versus pulse duration

1.E-03

1.E-02

1.E-01

1.E+00

I (A)

T =25°C

T =75°C

T =125°C

SMB flat

(non exposed pad)

δ=0.5

t(s)

0.001

0.01

0.1

0.01

0.1

100

1000

t (µs)

P(t )

(1µs)

ARM p

ARM

Figure 7.

Normalized avalanche power

derating versus junction

temperature

Figure 8.

Relative variation of thermal

impedance junction to ambient

versus pulse duration - SMC

0.2

0.4

0.6

0.8

1.2

100

125

150

T (°C)

P(t )

(25°C)

ARM p

ARM

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

Z/R

th(j-c)

δ=tp/T

t (s)

Single pulse

SMC

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