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©2022 Renesas Electronics Corporation

R31DS0067EU0401 February 10, 2022

XP Datasheet

Absolute Maximum Ratings

Stresses above the ratings listed below can cause permanent damage to the device. These ratings, which are standard values for

Renesas commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above

those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for

extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature

range. Thermal characteristics, in actual applications, should be assessed case by case to guarantee junction temperature does not

exceed 125°C.

1 Thermal characteristics are based on simulation in standard condition.

ESD Compliance

Mechanical Testing

* MSL level does not apply.

Solder Reflow Profile

Table 2. Absolute Maximum Ratings

Item

Rating

VDD

-0.5V to +3.8V

OE

-0.5V to +3.8V

Storage Temperature

-55°C to 125°C

Maximum Junction Temperature

125°C

Theta JA 1

JD8

75.9 °C/W

JX8

89.6 °C/W

JSW8

97.4 °C/W

Theta JB 1

48.6 °C/W

54.3 °C/W

66.8 °C/W

Table 3. ESD Compliance

Human Body Model (HBM)

2000V

Table 4. Mechanical Testing *

Parameter

Test Method

Mechanical Shock

Half-sine wave with 0.3ms 3000G. X, Y, Z each direction 1 time.

Mechanical Vibration

Frequency: 10 to 55MHz amplitude: 1.5mm.

Frequency: 55–2000Hz peak value: 20G.

Duration time: 4H for each X,Y,Z axis; total 12hours.

High Temp Operating Life (HTOL)

1000 hours at 125°C (under power).

Hermetic Seal

Gross leak (air leak test). Fine leak (Helium leak test) He-pressure: 6kgf/cm² 2 hours.

tP

10 seconds Max within5°C of

260°C peak

Ramp down not to

exceed 6°C/s

Ramp up 3°C/s Max

120±20 seconds in

pre-heating area

50 ±10 seconds

above 225°C

reflow area

400 seconds Max from+25°C to 260°C peak

25°C

160°C

180°C

225°C

260°C