Data Sheet

ADP1706/ADP1707/ADP1708

APPLICATIONS INFORMATION

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Rev. B | 16 of 19

Figure 38. 0 mm2 of PCB Copper, TA = 25°C, SOIC

Figure 39. 500 mm2 of PCB Copper, TA = 25°C, LFCSP

Figure 40. 100 mm2 of PCB Copper, TA = 25°C, LFCSP

Figure 41. 0 mm2 of PCB Copper, TA = 25°C, LFCSP

PCB LAYOUT CONSIDERATIONS

Heat dissipation from the package can be improved by increas-

ing the amount of copper attached to the pins of the ADP1706/

ADP1707/ADP1708. However, as can be seen from Table 7, a

point of diminishing returns is eventually reached, beyond which

an increase in the copper size does not yield significant heat

dissipation benefits.

The ADP1706/ADP1707/ADP1708 feature an exposed pad on the

bottom of both the SOIC and LFCSP packages to improve thermal

performance. Because the exposed pad is electrically connected

to GND inside the package, it is recommended that it also be

connected to the ground plane on the PCB with a sufficient amount

of copper.

Here are a few general tips when designing PCBs:

►

Place the input capacitor as close as possible to the IN and GND

pins.

►

Place the output capacitor as close as possible to the OUT and

GND pins.

►

For the ADP1706, place the soft start capacitor as close as

possible to the SS pin.

►

Connect the load as close as possible to the OUT and SENSE

pins.

Use of 0402 or 0603 size capacitors and resistors achieves the

smallest possible footprint solution on boards where area is limited.