74LVC2G08

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© NXP Semiconductors N.V. 2016. All rights reserved.

Product data sheet

Rev. 13 — 28 October 2016

2 of 22

NXP Semiconductors

74LVC2G08

Dual 2-input AND gate

3.

Ordering information

[1]

Type number 74LVC2G08GX is in development.

4.

Marking

[1]

The pin 1 indicator is located on the lower left corner of the device, below the marking code.

Table 1.

Ordering information

Type number

Package

Temperature range Name

Description

Version

74LVC2G08DP

40 C to +125 C

TSSOP8 plastic thin shrink small outline package; 8 leads;

body width 3 mm; lead length 0.5 mm

SOT505-2

74LVC2G08DC

40 C to +125 C

VSSOP8 plastic very thin shrink small outline package; 8 leads;

body width 2.3 mm

SOT765-1

74LVC2G08GT

40 C to +125 C

XSON8

plastic extremely thin small outline package; no leads;

8 terminals; body 1

 1.95  0.5 mm

SOT833-1

74LVC2G08GF

40 C to +125 C

XSON8

extremely thin small outline package; no leads;

8 terminals; body 1.35

 1  0.5 mm

SOT1089

74LVC2G08GD

40 C to +125 C

XSON8

plastic extremely thin small outline package; no leads;

8 terminals; body 3

 2  0.5 mm

SOT996-2

74LVC2G08GM

40 C to +125 C

XQFN8

plastic, extremely thin quad flat package; no leads;

8 terminals; body 1.6

 1.6  0.5 mm

SOT902-2

74LVC2G08GN

40 C to +125 C

XSON8

extremely thin small outline package; no leads;

8 terminals; body 1.2

 1.0  0.35 mm

SOT1116

74LVC2G08GS

40 C to +125 C

XSON8

extremely thin small outline package; no leads;

8 terminals; body 1.35

 1.0  0.35 mm

SOT1203

74LVC2G08GX[1]

40 C to +125 C

X2SON8 plastic thermal enhanced extremely thin small outline

package; no leads; 8 terminals; body 1.35

 0.8  0.35 mm

SOT1233

Table 2.

Marking codes

Type number

Marking code[1]

74LVC2G08DP

V08

74LVC2G08DC

V08

74LVC2G08GT

V08

74LVC2G08GF

VE

74LVC2G08GD

V08

74LVC2G08GM

V08

74LVC2G08GN

VE

74LVC2G08GS

VE

74LVC2G08GX

VE