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4

RT3301 Series Tact Switch

Recommended

Solder Process

Most contamination problems can be prevented by exercising care during the cleaning

and soldering process. Care should be taken not to immerse or spray unsealed switches during

flux removal. Contact E-Switch for specific soldering recommendations and specifications not

shown. Generalized soldering procedures are outlined below.

“TYPICAL” SMT REFLOW (Pb and Pb-Free)

Profile Feature

Sn-Pb Eutectic Assembly Pb-Free Assembly

Average Ramp-Up Rate

(Tsmax to Tp)

3 °C/second max.

3 °C/second max.

Preheat

-Temperature Min (Tsmin)

-Temperature Max (Tsmax)

-Time (tsmin to tsmax)

100 °C

150 °C

60-120 seconds

150 °C

200 °C

60-180 seconds

Time Maintained above:

-Temperature (TL)

-Time (tL)

183 °C

60-150 seconds

217 °C

60-150 seconds

Time within 5 °C of actual

Peak Temperature (tp)

10-30 seconds

20-40 seconds

Ramp-Down Rate

6 °C/second max.

6 °C/second max.

Time 25 °C to Peak

Temperature

6 minutes max.

8 minutes max.

Note 1: All temperatures refer to topside of the package, measured on the package surface.