ABSOLUTE MAXIMUM RATINGS

(1)

TSC2008

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

TYPICAL

TYPICAL

NO MISSING

INTEGRAL

GAIN

CODES

SPECIFIED

TRANSPORT

LINEARITY

ERROR

RESOLUTION

PACKAGE

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

MEDIA,

PRODUCT

(LSB)

(LSB)

(BITS)

TYPE

DESIGNATOR

RANGE

MARKING

NUMBER

QUANTITY

Small Tape

TSC2008RGVT

16-Pin,

and Reel, 250

4 x 4

RGV

–40°C to +85°C

TSC2008I

Tape and

QFN

TSC2008RGVR

Reel, 25000

TSC2008I

±1.5

–0.2/+4.4

11

Small Tape

12-Pin,

TSC2008IYZGT

and Reel, 250

3 x 4 Matrix,

YZG

–40°C to +85°C

TSC2008I

1.5 x 2

Tape and

TSC2008IYZGR

WCSP

Reel, 3000

(1)

For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or see

the TI website at www.ti.com.

Over operating free-air temperature range (unless otherwise noted).

PARAMETER

TSC2008

UNIT

Analog input X+, Y+, AUX to GND

–0.4 to VDD + 0.1

V

Voltage

Analog input X–, Y– to GND

–0.4 to VDD + 0.1

V

Voltage range

VDD to GND

–0.3 to +5

V

Digital input voltage to GND

–0.3 to VDD + 0.3

V

Digital output voltage to GND

–0.3 to VDD + 0.3

V

Power dissipation

QFN package

47

°C/W

Thermal impedance,

θ

JA

Low-K

113

°C/W

WCSP

High-K

62

°C/W

–40 to +85

°C

–65 to +150

°C

+150

°C

Vapor phase (60 sec)

+215

°C

Lead temperature

Infrared (15 sec)

+220

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to

absolute-maximum rated conditions for extended periods may affect device reliability.

2

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