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ST14C02C

Table 10. Ordering Information Scheme

Example:

ST14C02C -

D20

Delivery Form

D15

Module on Super 35 mm film

D20

Module on Super 35 mm film

W2

Unsawn wafer (275

µm ± 25 µm thickness)

W4

Unsawn wafer (180

µm ± 15 µm thickness)

S2x

Sawn wafer (275

µm ± 25 µm thickness)

S4x

Sawn wafer (180

µm ± 15 µm thickness)

where “x” indicates the sawing orientation, as follows (and as shown in Figure 11)

1

GND at top right

2

GND at bottom right

3

GND at bottom left

4

GND at top left

Figure 11. Sawing Orientation

AI02171

1

ORIENTATION

GND

GND

GND

GND

23

4

VIEW: WAFER FRONT SIDE