-7-

(5) Handling Precautions

· Bare Hand

When handling the product, touching encapsulant with bare hands will contaminate its surface that could

affects on optical characteristics.

In the worst cases, excessive force to the encapsulant by hands might

result in catastrophic failure of the LEDs due to wire deformation and/or breakage.

· Tweezers

When handling it with tweezers, the product should only be held by the ceramics body, not by the

encapsulant.

Failure to comply might result in chip-out and/or delamination of encapsulant, and in the

worst cases, catastrophic failure of the LEDs due to wire deformation and/or breakage.

· Pick and Place

The use of appropriate nozzle for this product is recommended.

(For the recommended nozzle size, refer to the figure at right.)

Avoid direct contact to the resin lens with the picking up nozzle.

Failure to comply might result in catastrophic failure of the LEDs

due to wire deformation and/or breakage.

· Printed Circuit Board Assembled (PCB with LEDs soldered)

Do not stack assembled PCBs together.

Since silicone is a soft material, abrasion between two PCB

assembled with silicone encapsulated LED might cause catastrophic failure of the LEDs due to damage

to encapsulant (such as scratch, chip-out and delamination) and wire (such as deformation and breakage)

and LED detachment.

3

3.8

(Unit : mm)

Nichia STS-DA1-0147

<Cat.No.080319>