AD7264BSTZ datasheet(28/32 Pages) AD

28 / 32 page

AD7264

Rev. A | Page 28 of 32

OUTLINE DIMENSIONS

PIN 1

INDICATOR

TOP

VIEW

6.75

BSC SQ

7.00

BSC SQ

5.25

5.10 SQ

4.95

0.50

0.40

0.30

0.23

0.18

0.50 BSC

12° MAX

0.20 REF

0.80 MAX

0.65 TYP

1.00

0.85

0.80

5.50

REF

0.05 MAX

0.02 NOM

0.60 MAX

PIN 1

INDICATOR

COPLANARITY

0.08

SEATING

PLANE

0.25 MIN

EXPOSED

PAD

(BOTTOM VIEW)

COMPLIANT TO JEDEC STANDARDS MO-220-VKKD-2

THE EXPOSED METAL PADDLE ON THE

BOTTOM OF THE LFCSP PACKAGE

MUST BE SOLDERED TO PCB GROUND

FOR PROPER HEAT DISSIPATION AND

ALSO FOR NOISE AND MECHANICAL

STRENGTH BENEFITS.

Figure 37. 48-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

7 mm × 7 mm Body, Very Thin Quad

(CP-48-1)

Dimensions shown in millimeters

COMPLIANT TO JEDEC STANDARDS MS-026-BBC

TOP VIEW

(PINS DOWN)

0.27

0.22

0.17

0.50

BSC

LEAD PITCH

1.60

MAX

0.75

0.60

0.45

VIEW A

PIN 1

0.20

0.09

1.45

1.40

1.35

0.08

COPLANARITY

VIEW A

ROTATED 90° CCW

SEATING

PLANE

7°

3.5°

0°

0.15

0.05

9.20

9.00 SQ

8.80

7.20

7.00 SQ

6.80

Figure 38. 48-Lead Low Profile Quad Flat Package [LQFP]

(ST-48)

Dimensions shown in millimeters

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