STD2NB50 datasheet(2/10 Pages) STMICROELECTRONICS

2 / 10 page

STD2NB50/STD2NB50-1

2/10

THERMAL DATA

AVALANCHE CHARACTERISTICS

ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)

OFF

ON (1)

DYNAMIC

Rthj-case

Thermal Resistance Junction-case Max

3.125

°C/W

Rthj-amb

Thermal Resistance Junction-ambient Max

100

°C/W

Maximum Lead Temperature For Soldering Purpose

275

°C

Symbol

Parameter

Max Value

Unit

IAR

Avalanche Current, Repetitive or Not-Repetitive

(pulse width limited by Tj max)

EAS

Single Pulse Avalanche Energy

(starting Tj = 25 °C, ID = IAR, VDD = 50 V)

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

V(BR)DSS

Drain-source

Breakdown Voltage

ID = 250 µA, VGS = 0

500

IDSS

Zero Gate Voltage

Drain Current (VGS = 0)

VDS = Max Rating

1µA

VDS = Max Rating, TC = 125 °C

µA

IGSS

Gate-body Leakage

Current (VDS = 0)

VGS = ±30V

±100

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

VGS(th)

Gate Threshold Voltage

VDS = VGS, ID = 250µA

2.3

3.7

RDS(on)

Static Drain-source On

Resistance

VGS = 10V, ID = 0.5 A

Ω

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

gfs (1)

Forward Transconductance

VDS > ID(on) x RDS(on)max,

ID = 0.5 A

0.75

Ciss

Input Capacitance

VDS = 25V, f = 1 MHz, VGS = 0

185

Coss

Output Capacitance

Crss

Reverse Transfer

Capacitance

4pF

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