Maximum rating

STCD1020, STCD1030, STCD1040

14/40

4

Maximum rating

Stressing the device above the rating listed in the "Absolute maximum ratings" table may

cause permanent damage to the device. These are stress ratings only and operation of the

device at these or any other conditions above those indicated in the Operating sections of

this specification is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability. Refer also to the STMicroelectronics SURE

Program and other relevant quality documents.

Table 4.

Absolute maximum ratings (1.8 V supply)

Symbol

Parameter

Value

Unit

-55 to 150

(1)

1.

Reflow at peak temperature of 255°C to 260°C for < 30 seconds (total thermal budget not to exceed 180°C

for between 90 to 150 seconds).

Lead solder temperature for 10 seconds

260

Maximum junction temperature

150

Supply voltage

-0.3 to 3.6

V

Input voltage level

-0.3 to 3.6

V

Voltage on enable pins

-0.3 to 3.6

V

θ

JA

Thermal resistance (junction to ambient)

TDFN8

149.0

TDFN10

136.6

TDFN12

132.4

Table 5.

Absolute maximum ratings (2.8 V supply)

Symbol

Parameter

Value

Unit

-55 to 150

(1)

1.

Reflow at peak temperature of 255°C to 260°C for < 30 seconds (total thermal budget not to exceed 180°C

for between 90 to 150 seconds).

Lead solder temperature for 10 seconds

260

Maximum junction temperature

150

Supply voltage

-0.3 to 6

V

Input voltage level

-0.3 to 6

V

Voltage on enable pins

-0.3 to 6

V

θ

JA

Thermal resistance (junction to ambient)

TDFN8

149.0

TDFN10

136.6

TDFN12

132.4