Package information

STTH1R04

6/10

2

Package information

●

Epoxy meets UL94, V0

●

Cooling method: by conduction (C)

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at www.st.com.

Table 6.

DO-41 (plastic) dimensions

Ref.

Dimensions

Millimeters

Inches

Min.

Max.

Min.

Max.

A

4.1

5.20

0.160

0.205

B

2

2.71

0.080

0.107

C25.4

1

D

0.712

0.863

0.028

0.034

Table 7.

DO-15 dimensions

Ref.

Dimensions

Millimeters

Inches

Min.

Max.

Min.

Max.

A

6.05

6.75

0.238

0.266

B

2.95

3.53

0.116

0.139

C

26

31

1.024

1.220

D

0.71

0.88

0.028

0.035

ØD ØB

A

CC

D

B

A

CC