STTH310

Package mechanical data

5/7

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect . The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Table 6.

DO-201AD dimensions

Ref.

Dimensions

Millimeters

Inches

Min.

Max.

Min.

Max.

A

9.50

0.374

B

25.40

1.000

C

5.30

0.209

D

1.30

0.051

E

1.25

0.049

Notes

1 - The lead diameter ø D is not

controlled over zone E

2 - The minimum length which must stay

straight between the right angles after

bending is 0.59"(15mm)

Table 7.

DO-201AD C2 dimensions

Ref.

Dimensions

Millimeters

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

A

9.5

0.374

B

13.75

17.75 0.541

0.699

C

5.3

0.208

D

1.3

0.051

E

3.1

3.6

4.1

0.122 0.142 0.161

F

2.4

3.15

3.9

0.094 0.124 0.153

G

1.6

0.063

H

14.9

15.6

0.587

0.614

I

0.5

0.6

0.8

0.019 0.024 0.031

J

18.78

0.739

K

3.8

4.8

0.150

0.189

Note

The difference between E dimensions on

both sides of resinous body (which

express the bending centering) musn’t be

larger than 0.7 millimeter.

ØC

ØD

A

EE

Note 2

Note 1

Note 1

BB

J

A

I

D

55.9°

50.8°

H

G = D + 0.2 to 0.4 mm

E

R0.5

R0.5

B

K

F

(G = hole in the PCB)

10° max

C