STPS5L60

Characteristics

5/8

Figure 15.

Figure 11.

Forward voltage drop versus

forward current (low level)

Figure 12.

Forward voltage drop versus

forward current (high level)

IFM(A)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

0.00

0.05

0.10

0.15

0.20

0.25

0.30

0.35

0.40

0.45

0.50

0.55

0.60

Tj=25°C

(Maximum values)

Tj=125°C

(Maximum values)

Tj=125°C

(Maximum values)

Tj=125°C

(Typical values)

Tj=125°C

(Typical values)

VFM(V)

IFM(A)

0

5

10

15

20

25

30

35

40

45

50

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

Tj=25°C

(Maximum values)

Tj=125°C

(Maximum values)

Tj=125°C

(Maximum values)

Tj=125°C

(Typical values)

Tj=125°C

(Typical values)

VFM(V)

Figure 13.

Thermal resistance junction to

ambient versus copper surface

under each lead (epoxy printed

board FR4, Cu = 35 µm) SMC

Figure 14.

Thermal resistance junction to

ambient versus copper surface

under each lead (epoxy printed

board FR4, Cu = 35 µm), DO-201AD

R

(°C/W)

th(j-a)

0

10

20

30

40

50

60

70

80

90

100

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

SMC

S

(cm²)

CU

Rth(j-a)(°C/W)

0

10

20

30

40

50

60

70

80

01

2345

678

9

10

DO-201AD

S(cm²)

0

10

20

30

40

50

60

70

80

510

15

20

25

Lleads(cm)

Rth(j-a): Epoxy printed circuit board FR4 (Cu=35µm)

Rth(j-l)

Rth(°C/W)