Ordering information

USBUF01P6

8/9

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

4

Ordering information

5

Revision history

Table 4.

Mechanical specifications

Lead plating

Tin-lead

Lead plating thickness

5 µm min

25 µm max

Lead material

Sn

(100% Sn)

Lead coplanarity

10 µm max

Body material

Molded epoxy

Flammability

UL94V-0

Part Number

Marking

Package

Weight

Base qty

Delivery mode

USBUF01P6

U

SOT-666IP

2.9 mg

3000

Tape and reel

Date

Revision

Description of Changes

September-2003

1

First issue.

01-Jun-2004

2

SOT-666 Internal Pad version package change.

08-Jun-2005

3

Minor format changes; no content changed.

10-Mar-2006

4

Footprint and dimension graphic improved in packaging

information. Ecopack statement added. Reformatted to

current standard.

16-Aug-2006

5

Updated SOT-666IP package dimensions in Table 3.

29-Aug-2006

6

Typing error in table 2 on page 2: change W and kW unit

to

Ω and kΩ unit.