ESDA14V2-4BF3

Ordering information scheme

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3

Ordering information scheme

Figure 11.

Ordering information scheme

4

Package information

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the inner box label, in compliance with JEDEC

Standard JESD97. The maximum ratings related to soldering conditions are also marked on

the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at

www.st.com.

Figure 12.

Package dimensions

ESDA

14V2 - 4

B

Fx

ESD Array

Number of line

Package

Breakdown Voltage

Type

14V2 = 14.2 Volts min.

B = Bidirectional

4 = 4 lines

F = Flip Chip

x = 3: lead-free, pitch = 400µm, bump height = 255 µm

0.935 mm ± 30µm

255 µm ± 40

565 µm ± 40

185 µm ± 10

605 µm ± 55

185 µm