Ordering information

EMIF02-MIC02F3

6/8

Figure 16.

Flip Chip tape and reel specifications

Note:

More information is available in the application notes:

AN2348: “STMicroelectronics 400 micro-metre Flip Chip: Package description and

recommendation for use”

AN1751: EMI Filters: Recommendations and measurements

5

Ordering information

Figure 14.

Footprint

Figure 15.

Marking

220 µm recommended

220 µm recommended

260 µm maximum

Solder stencil opening :

Copper pad Diameter:

Solder mask opening:

300 µm minimum

x

y

x

w

z

w

E

Dot, ST logo

xx = marking

yww = datecode

(y = year

ww = week)

z = manufacturing location

Dot identifying Pin A1 location

User direction of unreeling

All dimensions in mm

4 ± 0.1

4 ± 0.1

Ø 1.5 ± 0.1

0.71 ± 0.05

0.87

Table 3.

Ordering information

Order code

Marking

Package

Base qty

Delivery mode

EMIF02-MIC02F3

HB

Flip Chip

5000

Tape and reel (7”)