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TS4990 데이터시트(PDF) 25 Page - STMicroelectronics

부품명 TS4990
상세설명  1.2 W audio power amplifier with active low standby mode
PDF  32 Pages
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제조업체  STMICROELECTRONICS [STMicroelectronics]
홈페이지  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

TS4990 데이터시트(HTML) 25 Page - STMicroelectronics

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TS4990
Package information
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Figure 67.
Package mechanical data for 9-bump flip-chip package
Figure 68.
Daisy chain mechanical data
The daisy chain sample features two-by-two pin connections. The schematics in Figure 68
illustrate the way pins connect to each other. This sample is used to test continuity on your
board. Your PCB needs to be designed the opposite way, so that pins that are unconnected
in the daisy chain sample, are connected on your PCB. If you do this, by simply connecting
an Ohmmeter between pin A1 and pin A3, the soldering process continuity can be tested.
Die size: 1.60 x 1.60 mm ±30µm
Die height (including bumps): 600µm
Bump diameter: 315µm ±50µm
Bump diameter before reflow: 300µm ±10µm
Bump height: 250µm ±40µm
Die height: 350µm ±20µm
Pitch: 500µm ±50µm
Coplanarity: 50µm max
* Back coating height: 100µm ±10µm
* Optional
1.60 mm
1.60 mm
0.5mm
0.5mm
∅ 0.25mm
1.60 mm
1.60 mm
0.5mm
0.5mm
∅ 0.25mm
600µm
100µm
600µm
100µm
A
C
B
1
2
3
1.6mm
1.6mm
A
C
B
1
2
3
1.6mm
1.6mm



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