M48Z58, M48Z58Y

Maximum rating

13/23

3

Maximum rating

Stressing the device above the rating listed in the “Absolute Maximum Ratings” table may

cause permanent damage to the device. These are stress ratings only and operation of the

device at these or any other conditions above those indicated in the Operating sections of

this specification is not implied. Exposure to Absolute Maximum Rating conditions for

extended periods may affect device reliability. Refer also to the STMicroelectronics SURE

Program and other relevant quality documents.

Table 5.

Absolute maximum ratings

Caution:

Negative undershoots below –0.3V are not allowed on any pin while in the battery back-up

mode.

Caution:

Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.

Symbol

Parameter

Value

Unit

Ambient operating temperature

0 to 70

°C

–40 to 85

°C

–40 to 85

°C

SOIC

–55 to 125

°C

(1)(2)

1.

For DIP package: Soldering temperature not to exceed 260°C for 10 seconds (total thermal budget not to exceed 150°C for

longer than 30 seconds).

2.

For SO package, Lead-free (Pb-free) lead finish: Reflow at peak temperature of 260°C (total thermal budget not to exceed

245°C for greater than 30 seconds).

Lead solder temperature for 10 seconds

260

°C

Input or output voltages

–0.3 to 7.0

V

Supply voltage

–0.3 to 7.0

V

Output current

20

mA

Power dissipation

1

W