Package information

TS2012

28/30

Figure 48.

QFN20 package footprint

Note:

The QFN20 package has an exposed pad E2 x D2. For enhanced thermal performance, the

exposed pad must be soldered to a copper area on the PCB, acting as a heatsink. This

copper area can be electrically connected to pin 4, 12, 18 (PGND, AGND) or left floating.

Table 10.

QFN20 package mechanical data

Ref

Dimensions in mm

Min

Typ

Max

A0.8

0.9

1

A1

0.02

0.05

A2

0.65

1

A3

0.25

b

0.18

0.23

0.3

D

3.85

4

4.15

D2

2.6

E

3.85

4

4.15

E2

2.6

e

0.45

0.5

0.55

L0.3

0.4

0.5

ddd

0.08

A4.55

B4.55

C0.50

D0.35

E0.65

F2.45

G0.40

FOOTPRINT DATA (mm)