ST62T52CMC datasheet(68/72 Pages) STMICROELECTRONICS

68 / 72 page

68/72

ST62T52CM-Auto ST62T62CM-Auto

THERMAL CHARACTERISTICS

7.2 SOLDERING INFORMATION

In accordance with the RoHS European directive,

all STMicroelectronics packages have been con-

verted to lead-free technology, named ECO-

PACK

® .

■ ECOPACK

® packages are qualified according

to the JEDEC STD-020B compliant soldering

profile.

■ Detailed information on the STMicroelectronics

ECOPACK

® transition program is available on

www.st.com/stonline/leadfree/,

with

specific

technical application notes covering the main

technical

aspects

lead-free

conversion

(AN2033,

AN2034,

AN2035,

AN2036).

Forward compatibility

ECOPACK

® LQFP packages are fully compatible

with lead (Pb) containing soldering process (see

application note AN2034).

Table 22. Soldering Compatibility (Wave and Reflow Soldering Process)

7.3 OTP/EPROM VERSION ORDERING INFORMATION

Table 23. OTP/EPROM VERSION ORDERING INFORMATION

7.4 IMPORTANT NOTE

For OTP devices, data retention and programmability must be guaranteed by a screening procedure. Re-

fer to Application Note AN886.

Symbol

Parameter

Test Conditions

Value

Unit

Min.

Typ.

Max.

RthJA

Thermal Resistance

SO16

°C/W

Package

Plating Material Devices

Pb Solder Paste

Pb-free Solder Paste

SO16

NiPdAu

Yes

Sales Type

Program

Memory (Bytes)

EEPROM (Bytes)

Temperature Range

Package

ST62E62CF1

1836 EPROM

0 to +70°C

CDIP16W

ST62T62CMA

1836 OTP

-40 to + 85°C

SO16

ST62T62CMC

-40 to + 125°C

ST62T52CMA

1836 OTP

None

-40 to + 85°C

ST62T52CMC

-40 to + 125°C

ST62T52CMC 데이터시트(PDF) 68 Page - STMicroelectronics

ST62T52CMC 데이터시트(HTML) 68 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72

데이터시트 다운로드

링크 URL