STA333ML

Package thermal characteristics

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Package thermal characteristics

The amount of power dissipated within the device depends primarily on the supply voltage,

load impedance and output modulation level. For the STA333ML the maximum dissipated

power is approximately 3 W.

Thus, at an ambient temperature of 70 °C (the generally recommended maximum for

consumer applications) the device can tolerate a further temperature rise of around 80° C

found.

Now, a thermal resistance of 25° C/W can be achieved using a ground copper area of

near to the upper recomended operating limits.

Figure 6.

Using the PCB as heatsink