ADA4857-1YCPZ-R2 datasheet(6/20 Pages) AD

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ADA4857-1/ADA4857-2

Rev. 0 | Page 6 of 20

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Supply Voltage

11 V

Power Dissipation

See Figure 4

Common-Mode Input Voltage

−VS + 0.7 V to +VS − 0.7 V

Differential Input Voltage

±VS

Exposed Paddle Voltage

−VS

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +125°C

Lead Temperature (Soldering, 10 sec)

300°C

Junction Temperature

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, θJA is specified

for device soldered in circuit board for surface-mount packages.

Table 4.

Package Type

θJA

θJC

Unit

8-Lead SOIC

115

°C/W

8-Lead LFCSP

94.5

34.8

°C/W

16-Lead LFSCP

68.2

°C/W

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation for the ADA4857 is

limited by the associated rise in junction temperature (TJ) on

the die. At approximately 150°C, which is the glass transition

temperature, the properties of the plastic change. Even temporarily

exceeding this temperature limit may change the stresses that

the package exerts on the die, permanently shifting the parametric

performance of the ADA4857. Exceeding a junction temperature of

175°C for an extended period can result in changes in silicon

devices, potentially causing degradation or loss of functionality.

The power dissipated in the package (PD) is the sum of the

quiescent power dissipation and the power dissipated in the

die due to the ADA4857 drive at the output. The quiescent

power is the voltage between the supply pins (VS) times the

quiescent current (IS).

PD = Quiescent Power + (Total Drive Power − Load Power)

()

OUT

–

⎟⎟

⎠

⎞

⎜⎜

⎝

⎛

RMS output voltages should be considered. If RL is referenced to

−VS, as in single-supply operation, the total drive power is VS ×

IOUT. If the rms signal levels are indeterminate, consider the

worst case, when VOUT = VS/4 for RL to midsupply.

() (

)

In single-supply operation with RL referenced to −VS, worst case

is VOUT = VS/2.

Airflow increases heat dissipation, effectively reducing θJA.

In addition, more metal directly in contact with the package

leads and exposed paddle from metal traces, through holes,

ground, and power planes reduce θJA.

Figure 4 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the SOIC and LFCSP

packages on a JEDEC standard 4-layer board. θJA

values are approximations.

0.5

1.0

1.5

2.0

2.5

3.0

–40 –30 –20 –10 0 102030405060708090 100 110 120

AMBIENT TEMPERATURE (°C)

ADA4857-1 (SOIC)

ADA4857-1 (LFCSP)

ADA4857-2 (LFCSP)

Figure 4. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

ESD CAUTION

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