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TUSB6015 데이터시트(PDF) 22 Page - Texas Instruments |
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TUSB6015 데이터시트(HTML) 22 Page - Texas Instruments |
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22 / 28 page ![]() TUSB6015ZQE SLLS937 REVISION 1.4 SEPTEMBER 12, 2008 Mechanical Characteristics TUSB6015 uses an 80-pin u*BGA package. The lead-free solder ball composition is Sn/Ag1.2Cu0.5 The substrate plating on the die side where the die bonds to is NiAu, The substrate finish on the bottom side where the solder balls attach to is bare Cu. ZQE (S-PBGA-N80) Plastic Ball Grid Array 22 WWW.TI.COM |
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