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STPS130A 데이터시트(PDF) 4 Page - STMicroelectronics |
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STPS130A 데이터시트(HTML) 4 Page - STMicroelectronics |
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4 / 6 page ![]() 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0.01 0.10 1.00 10.00 VFM(V) IFM(A) Tj=25 °C Tj=75 °C Tj=125 °C Fig. 7: Forward voltage drop versus forward cur- rent (maximum values). 012345 0 20 40 60 80 100 120 S(Cu) (cm ) Rth(j-a) ( °C/W) P=1.5W Fig. 8-1: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board, copper thickness: 35 µm).(SMB) 012345 0 20 40 60 80 100 120 140 S(Cu) (cm ) Rth(j-a) ( °C/W) P=1.5W Fig. 8-2: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board, copper thickness: 35 µm).(SMA) STPS130A/U 4/6 |
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