4/5

STPS5L40

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

0.0

0.1

0.2

0.3

0.4

0.5

0.6

VFM(V)

Tj=25°C

(Maximum values)

Tj=125°C

(Maximum values)

Tj=125°C

(Maximum values)

Tj=125°C

(Typical values)

Tj=125°C

(Typical values)

IFM(A)

Fig. 9-1: Forward voltage drop versus forward

current (low level).

1

10

100

0.0

0.3

0.5

0.8

1.0

1.3

1.5

VFM(V)

Tj=25°C

(Maximum values)

Tj=125°C

(Maximum values)

Tj=125°C

(Maximum values)

Tj=125°C

(Typical values)

Tj=125°C

(Typical values)

IFM(A)

Fig. 9-2: Forward voltage drop versus forward

current (high level).

0

10

20

30

40

50

60

70

80

01234

56789

10

S(cm²)

Rth(j-a)(°C/W)

Fig. 10: Thermal resistance junction to ambient

versus copper surface under each lead (epoxy

printed board FR4, Cu = 35µm).

0

10

20

30

40

50

60

70

80

5

10

152025

Lleads(cm)

Rth(j-a): Epoxy printed circuit board FR4 (Cu= 35µm)

Rth(j-l)

Rth(°C/W)

Fig. 11: Thermal resistances versus leads length.