IEC SAFETY LIMITING VALUES

THERMAL CHARACTERISTICS

0

25

50

75

100

125

150

175

200

225

250

275

300

0

50

100

150

200

T -CaseTemperature-°C

C

V

at3.6V

CC1,2

ISO15

ISO35

Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry.

A failure of the IO can allow low resistance to ground or the supply and, without current limiting, dissipate

sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system

failures.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

θ

Safety input, output, or supply current

DW-16

210

mA

Maximum case temperature

DW-16

150

°C

The safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum

ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the

application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the

Thermal Characteristics table is that of a device installed in the JESD51-3, Low Effective Thermal Conductivity

Test Board for Leaded Surface Mount Packages and is conservative. The power is the recommended maximum

input voltage times the current. The junction temperature is then the ambient temperature plus the power times

the junction-to-air thermal resistance.

over recommended operating conditions (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

168

θ

JA

Junction-to-Air

°C/W

High-K Thermal Resistance

96.1

θ

JB

Junction-to-Board Thermal Resistance

61

°C/W

θ

JC

Junction-to-Case Thermal Resistance

48

°C/W

Device Power Dissipation

220

mW

Input a 20 MHz 50% duty cycle square wave

(1)

Tested in accordance with the Low-K or High-K thermal metric defintions of EIA/JESD51-3 for leaded surface mount packages.

Figure 14. DW-16

θ

Copyright © 2008, Texas Instruments Incorporated

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