Figure 7 : Maximum Power Dissipation and

Junction-ambient Thermal

Resistance versus ”I”

Figure 8 : Maximum Allowable Power Dissipation

versus Ambient Temperature

pins to a suitable copper area of the printed circuit

board (Figure 5) or to an external heatsink (Fig-

ure 6).

The diagram of Figure 7 shows the maximum

of the side ”I” of two equal square copper areas

having a thicknessof 35

µ (1.4 mils).

During soldering the pins temperature must not

exceed 260

°C and the soldering time must not be

longer than 12 seconds.

The external heatsink or printed circuit copper area

must be connected to electrical ground.

MOUNTING INSTRUCTION

Figure 5 : Example of P.C. Board Copper Area

Figure 6 : External Heatsink Mounting Example

TDA1175P

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