150 CLZ

Vishay BCcomponents

Aluminum Capacitors

SMD (Chip), Very Low Z

www.vishay.com

For technical questions, contact: aluminumcaps1@vishay.com

Document Number: 28304

2

Revision: 03-Jul-08

Table 1

Table 2

Note

1. Detailed tape dimensions see section “PACKAGING”.

MOUNTING

The capacitors are designed for automatic placement on to

printed-circuit boards.

Optimum dimensions of soldering pads depend amongst

others on soldering method, mounting accuracy, print layout

and/or adjacent components.

For recommended soldering pad dimensions, refer to Fig.3

and Table 3.

SOLDERING

Soldering conditions are defined by the curve, temperature

versus time, where the temperature is that measured on the

soldering pad during processing.

For maximum conditions refer to Fig.4.

Any temperature versus time curve which does not exceed

the specified maximum curves may be applied.

Table 3

AS A GENERAL PRINCIPLE, TEMPERATURE AND

DURATION SHALL BE THE MINIMUM NECESSARY

REQUIRED

TO

ENSURE

GOOD

SOLDERING

CONNECTIONS. HOWEVER, THE SPECIFIED MAXIMUM

CURVES SHOULD NEVER BE EXCEEDED.

DIMENSIONS in millimeters AND MASS

NOMINAL

CASE SIZE

Lx Wx H

CASE

CODE

Ø D

MASS

(g)

8 x 8 x 10

0810

8.5

8.5

10.5

8.0

1.0

3.1

9.9

≈ 1.0

10 x 10 x 10

1010

10.5

10.5

10.5

10.0

1.0

4.5

11.8

≈ 1.3

10 x 10 x 14

1014

10.5

10.5

14.3

10.0

1.0

4.5

11.8

≈ 1.5

0.4 ± 0.2

W B

CS

L

C

0.3 max.

Fig.2 Dimensional outline

TAPE AND REEL DIMENSIONS in millimeters, PACKAGING QUANTITIES

NOMINAL

CASE SIZE

LxW x H

CASE

CODE

PITCH

TAPE WIDTH

W

TAPE THICKNESS

REEL DIA.

PACKAGING

QUANTITY

PER REEL

8 x 8 x 10

0810

16

24

11.3

380

500

10 x 10 x 10

1010

16

24

11.3

380

500

10 x 10 x 14

1014

16

24

14.8

330

250

RECOMMENDED SOLDERING PAD

DIMENSIONS in millimeters

CASE CODE

a

b

c

0810

3.5

2.5

3.0

1010

4.3

2.5

4.0

1014

4.3

2.5

4.0

Fig.3 Recommended solder pad dimensions

280

260

240

220

200

180

160

140

120

100

80

0

50

100

150

200

250

Fig.4 Maximum temperature load during infrared reflow

soldering measured on the soldering pad

t (s)

T

PAD

(°C)