175 TMP

Aluminum Capacitors

High Temperature Solid Electrolytic SMD

Vishay BCcomponents

Document Number: 28305

For technical questions, contact: aluminumcaps2@vishay.com

www.vishay.com

Revision: 04-Nov-08

75

Table 1

Table 2

AS A GENERAL PRINCIPLE, TEMPERATURE AND DURATION

SHALL BE THE MINIMUM NECESSARY REQUIRED TO ENSURE

GOOD SOLDERING CONNECTIONS.

MOUNTING

The capacitors are designed for automatic placement on to

printed-circuit boards.

Optimum dimensions of soldering pads depend amongst

others on soldering method, mounting accuracy, print layout

and/or adjacent components.

For recommended soldering pad dimensions, refer to Fig.3

and Table 3.

SOLDERING

Soldering conditions are defined by the curve, temperature

versus time, where the temperature is that measured on the

soldering pad during processing.

Resistant against 260 °C reflow temperature; see Fig.4.

Any temperature versus time curve which does not exceed

the specified maximum curves may be applied.

Table 3

TAPE AND REEL DIMENSIONS in millimeters

CASE CODE

PITCH

TAPE WIDTH

W

TAPE THICKNESS

REEL DIA.

PACKAGING

QUANTITY

PER REEL

0810

16

24

11

380

500

DIMENSIONS in millimeters AND MASS (see Fig.2)

NOMINAL

CASE SIZE

L x W x H

CASE

CODE

Ø D

SC

MASS

(g)

8.0 x 8.0 x 10.0

0810

8.4

8.4

10.7

8.0

1

4.7

2.2 ± 0.2

≈ 0.8

Fig.2 Dimensional outline

H

W B

0.3

max.

D

S

L

0.4 ± 0.2

CC

+

+

-

ca

a

b

Fig.3 Recommended soldering pad dimensions

RECOMMENDED SOLDERING PAD

DIMENSIONS in millimeters

CASE CODE

a

b

c

0810

3.0

2.5

4.0

0

50

100

150

200

250

300

0

50

100

150

200

250

300

t (s)

Fig.4 Maximum temperature load during infrared reflow soldering

measured on the soldering pad