AD9783-EBZ datasheet(5/36 Pages) AD

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AD9780/AD9781/AD9783

Rev. A | Page 5 of 36

ABSOLUTE MAXIMUM RATINGS

THERMAL RESISTANCE

Table 4.

Thermal resistance is tested using a JEDEC standard 4-layer

thermal test board with no airflow.

Parameter

With

Respect to

Rating

AVDD33, DVDD33

AGND, DGND, CGND

−0.3 V to +3.6 V

DVDD18, CVDD18

AGND, DGND, CGND

−0.3 V to +1.98 V

AGND

DGND, CGND

−0.3 V to +0.3 V

DGND

AGND, CGND

−0.3 V to +0.3 V

CGND

AGND, DGND

−0.3 V to +0.3 V

REFIO

AGND

−0.3 V to

AVDD33 + 0.3 V

IOUT1P, IOUT1N,

IOUT2P, IOUT2N,

AUX1P, AUX1N,

AUX2P, AUX2N

AGND

−1.0 V to

AVDD33 + 0.3 V

D15 to D0

DGND

−0.3 V to

DVDD33 + 0.3 V

CLKP, CLKN

CGND

−0.3 V to

CVDD18 + 0.3 V

CSB, SCLK, SDIO, SDO

DGND

–0.3 V to

DVDD33 + 0.3 V

Junction Temperature

+125°C

Storage Temperature

−65°C to +150°C

Table 5.

Package Type

θJA

Unit

CP-72-1 (Exposed Pad Soldered to PCB)

°C/W

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ESD CAUTION

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