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PCA2000U/AB 데이터시트(PDF) 2 Page - NXP Semiconductors

부품명 PCA2000U/AB
상세설명  32 kHz watch circuit with programmable adaptive motor pulse
PDF  28 Pages
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제조업체  NXP [NXP Semiconductors]
홈페이지  http://www.nxp.com
Logo NXP - NXP Semiconductors

PCA2000U/AB 데이터시트(HTML) 2 Page - NXP Semiconductors

  PCA2000U/AB Datasheet HTML 1Page - NXP Semiconductors PCA2000U/AB Datasheet HTML 2Page - NXP Semiconductors PCA2000U/AB Datasheet HTML 3Page - NXP Semiconductors PCA2000U/AB Datasheet HTML 4Page - NXP Semiconductors PCA2000U/AB Datasheet HTML 5Page - NXP Semiconductors PCA2000U/AB Datasheet HTML 6Page - NXP Semiconductors PCA2000U/AB Datasheet HTML 7Page - NXP Semiconductors PCA2000U/AB Datasheet HTML 8Page - NXP Semiconductors PCA2000U/AB Datasheet HTML 9Page - NXP Semiconductors Next Button
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PCA2000_2001_5
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 11 November 2008
2 of 28
NXP Semiconductors
PCA2000; PCA2001
32 kHz watch circuit with programmable adaptive motor pulse
I End Of Life (EOL) indication for silver oxide or lithium battery (only the PCA2000 has
the EOL feature)
I Test mode for accelerated testing of the mechanical parts of the watch and the IC
I Test bits for type recognition
3.
Applications
I Driver circuits for bipolar stepping motors
I High immunity motor drive circuits
4.
Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Delivery form
Version
PCA2000U/AB
PCA200xU
wire bond die; 8 bonding pads;
1.16
× 0.86 × 0.22 mm
chip in tray
PCA200xU
PCA2001U/AB
PCA200xU
wire bond die; 8 bonding pads;
1.16
× 0.86 × 0.22 mm
chip in tray
PCA200xU
PCA2000U/10AB PCA200xU
wire bond die; 8 bonding pads;
1.16
× 0.86 × 0.22 mm
chip on film frame carrier
PCA200xU
PCA2001U/10AB PCA200xU
wire bond die; 8 bonding pads;
1.16
× 0.86 × 0.22 mm
chip on film frame carrier
PCA200xU
PCA2000CX8/5
PCA200xCX
wafer level chip-size package; 8 bumps;
1.16
× 0.86 × 0.31 mm
unsawn wafer with lead
free solder bumps
PCA200xCX
PCA2001CX8/5
PCA200xCX
wafer level chip-size package; 8 bumps;
1.16
× 0.86 × 0.31 mm
unsawn wafer with lead
free solder bumps
PCA200xCX



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