PCA9535_PCA9535C_5

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 05 — 15 September 2008

5 of 31

NXP Semiconductors

PCA9535; PCA9535C

5.2 Pin description

[1]

thermal, electrical, and board-level performance, the exposed pad needs to be soldered to the board using

a corresponding thermal pad on the board, and for proper heat conduction through the board thermal vias

need to be incorporated in the PCB in the thermal pad region.

[2]

PCA9535 I/Os are totem pole, whereas the I/Os on PCA9535C are open-drain.

Table 3.

Pin description

Symbol

Pin

Description

SO24, TSSOP24

HVQFN24,

HWQFN24

INT

1

22

interrupt output (open-drain)

A1

2

23

address input 1

A2

3

24

address input 2

IO0_0

4

1

port 0 input/output[2]

IO0_1

5

2

IO0_2

6

3

IO0_3

7

4

IO0_4

8

5

IO0_5

9

6

IO0_6

10

7

IO0_7

11

8

12

9[1]

supply ground

IO1_0

13

10

port 1 input/output[2]

IO1_1

14

11

IO1_2

15

12

IO1_3

16

13

IO1_4

17

14

IO1_5

18

15

IO1_6

19

16

IO1_7

20

17

A0

21

18

address input 0

SCL

22

19

serial clock line

SDA

23

20

serial data line

24

21

supply voltage