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PCF2123TS 데이터시트(PDF) 52 Page - NXP Semiconductors |
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PCF2123TS 데이터시트(HTML) 52 Page - NXP Semiconductors |
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52 / 54 page ![]() PCF2123_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 19 November 2008 52 of 54 NXP Semiconductors PCF2123 SPI Real time clock/calendar For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 19. Abbreviations 20. Revision history MSL: Moisture Sensitivity Level Fig 34. Temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = MSL limit, damage level peak temperature Table 49. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor BCD Binary Coded Decimal FFC Film Frame Carrier HBM Human Body Model LSB Least Significant Bit MM Machine Model MOS Metal Oxide Semiconductor MSB Most Significant Bit MSL Moisture Sensitivity Level PCB Printed-Circuit Board RTC Real Time Clock SMD Surface Mount Device SPI Serial Peripheral Interface Table 50. Revision history Document ID Release date Data sheet status Change notice Supersedes PCF2123_1 20081119 Product data sheet - - |
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