PZUXBA_SER_1

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 01 — 19 September 2008

4 of 14

NXP Semiconductors

PZUxBA series

Single Zener diodes

5.

Limiting values

[1]

[2]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[3]

6.

Thermal characteristics

[1]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2]

[3]

Soldering point of cathode tab.

7.

Characteristics

[1]

Table 5.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

forward current

-

200

mA

non-repetitive peak reverse

current

[1] -

see

Table 8

and 9

non-repetitive peak reverse

power dissipation

[1] -40

W

total power dissipation

[2] -

320

mW

[3] -

490

mW

junction temperature

-

150

°C

ambient temperature

−55

+150

°C

storage temperature

−65

+150

°C

Table 6.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance from

junction to ambient

in free air

[1] -

-

390

K/W

[2] -

-

255

K/W

thermal resistance from

junction to solder point

[3] --55

K/W

Table 7.

Characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

forward voltage

[1]

-

-

0.9

V

-

-

1.1

V