Fig.1 : Maximum average power dissipation versus

average on-state current.

Fig.2 : Correlation between maximum average power

dissipation and maximum allowable temperatures (Tamb

and Tcase) for different thermal resistances heatsink +

contact.

Fig.5 : Relative variation of gate trigger current versus

junction temperature.

Fig.6 :

Non repetitive surge peak on-state current

versus number of cycles.

Fig.3

:

Average

on-state

current

versus

case

temperature.

1E-3

1E-2

1E-1

1E +0

1 E +1

1E +2 5 E+2

0.01

0.1

1

Zth/Rth

Zt h( j-c )

Zt h( j-a )

tp (s )

Fig.4 :

Relative variation of thermal impedance versus

pulse duration.

TYP 212 ---> TYP 2012

3/5