LT1017/LT1018

12

10178ff

PACKAGE DESCRIPTION

H Package

8-Lead TO-5 Metal Can (.200 Inch PCD)

(Reference LTC DWG # 05-08-1320)

OBSOLETE PACKAGE

.050

(1.270)

MAX

.016 – .021**

(0.406 – 0.533)

.010 – .045*

(0.254 – 1.143)

SEATING

PLANE

.040

(1.016)

MAX

.165 – .185

(4.191 – 4.699)

GAUGE

PLANE

REFERENCE

PLANE

.500 – .750

(12.700 – 19.050)

.305 – .335

(7.747 – 8.509)

.335 – .370

(8.509 – 9.398)

DIA

.200

(5.080)

TYP

.027 – .045

(0.686 – 1.143)

.028 – .034

(0.711 – 0.864)

.110 – .160

(2.794 – 4.064)

INSULATING

STANDOFF

45°

H8(TO-5) 0.200 PCD 0204

LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE

AND THE SEATING PLANE

FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS

.016 – .024

(0.406 – 0.610)

*

**

PIN 1

H Package

8-Lead TO-5 Metal Can (.200 Inch PCD)

(Reference LTC DWG # 05-08-1320)

OBSOLETE PACKAGE

.050

(1.270)

MAX

.016 – .021**

(0.406 – 0.533)

.010 – .045*

(0.254 – 1.143)

SEATING

PLANE

.040

(1.016)

MAX

.165 – .185

(4.191 – 4.699)

GAUGE

PLANE

REFERENCE

PLANE

.500 – .750

(12.700 – 19.050)

.305 – .335

(7.747 – 8.509)

.335 – .370

(8.509 – 9.398)

DIA

.200

(5.080)

TYP

.027 – .045

(0.686 – 1.143)

.028 – .034

(0.711 – 0.864)

.110 – .160

(2.794 – 4.064)

INSULATING

STANDOFF

45°

H8(TO-5) 0.200 PCD 0204

LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE

AND THE SEATING PLANE

FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS

.016 – .024

(0.406 – 0.610)

*

**

PIN 1