Rev. 03

Rev. 03

May 2008

May 2008

www.ZLED.com

www.ZLED.com

19

Solder profile

1. Reflow solder conditions / profile

Pre-heating

200

180

150

0

220

240

260

Rising

5 °C/sec

Tm : Reflow machine setting temp (max 30 sec.)

Ts : Surface temp of PCB (min)

Ts : Surface temp of PCB (max)

Ts : Surface temp of PCB (recommend)

Cooling

-5 °C/sec

Time

[Hr]

2. Hand Solder conditions

2-1 Lead : Not more than 3 seconds @MAX280℃

2-2 Slug : Use a thermal-adhesives

* Caution

[1] Reflow soldering should not be done more than one time.

[2] Repairing should not be done after the LEDs have been soldered. When

repairing is unavoidable, suitable tools have to be used.

[3] Die slug is to be soldered.

[4] When soldering, do not put stress on the LEDs during heating.

[5] After soldering, do not warp the circuit board.

[6] Recommend to use a convection type reflow machine with 7 ~ 8 zones.