| 전자부품 데이터시트 검색엔진 |
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WH2001 데이터시트(PDF) 15 Page - Seoul Semiconductor |
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WH2001 데이터시트(HTML) 15 Page - Seoul Semiconductor |
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15 / 16 page ![]() Document No. : SSC-QP-7-07-24 (Rev.00) Rev. 00 Rev. 00 September 2008 September 2008 www.ZLED.com www.ZLED.com 9. Soldering 10 sec. Max. Soldering time Condition 240℃ Max. Peak-Temperature 120 sec. Max. Pre-heat time 120~150℃ Pre-heat Lead Solder 10 sec. Max. Soldering time Condition 260℃ Max. Peak-Temperature 120 sec. Max. Pre-heat time 150~200℃ Pre-heat Lead Free Solder 260 C Max. 10 sec. Max. o 60sec. Max. Above 220 C 120sec. Max. Pre-heating 150~200 C 1~5 C / sec. o o o o 1~5 C / sec. Lead Solder 2.5~5 C / sec. o o o Pre-heating 120~150 C 120sec. Max. 60sec. Max. Above 200 C o 240 C Max. 10 sec. Max. 2.5~5 C / sec. (1) Lead Solder (2) Lead-Free Solder Lead-frame Solder (3) Hand Soldering conditions Do not exceed 3 seconds at maximum 280ºC under soldering iron. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. |
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