23

LTC1594/LTC1598

15948fb

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

G Package

24-Lead Plastic SSOP (5.3mm)

(Reference LTC DWG # 05-08-1640)

S Package

16-Lead Plastic Small Outline (Narrow .150 Inch)

(Reference LTC DWG # 05-08-1610)

G24 SSOP 0204

0.09 – 0.25

(.0035 – .010)

0

° – 8°

0.55 – 0.95

(.022 – .037)

5.00 – 5.60**

(.197 – .221)

7.40 – 8.20

(.291 – .323)

12 3

4

5

6 7 8

9 10 11 12

7.90 – 8.50*

(.311 – .335)

21

22

18 17 16 15 14 13

19

20

23

24

2.0

(.079)

MAX

0.05

(.002)

MIN

0.65

(.0256)

BSC

0.22 – 0.38

(.009 – .015)

TYP

MILLIMETERS

(INCHES)

DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED .152mm (.006") PER SIDE

DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD

FLASH SHALL NOT EXCEED .254mm (.010") PER SIDE

*

**

NOTE:

1. CONTROLLING DIMENSION: MILLIMETERS

2. DIMENSIONS ARE IN

3. DRAWING NOT TO SCALE

0.42

±0.03

0.65 BSC

5.3 – 5.7

7.8 – 8.2

RECOMMENDED SOLDER PAD LAYOUT

1.25

±0.12

.016 – .050

(0.406 – 1.270)

.010 – .020

(0.254 – 0.508)

× 45°

0

° – 8° TYP

.008 – .010

(0.203 – 0.254)

1

N

2

3

4

5

6

7

8

N/2

.150 – .157

(3.810 – 3.988)

NOTE 3

16

15

14

13

.386 – .394

(9.804 – 10.008)

NOTE 3

.228 – .244

(5.791 – 6.197)

12

11

10

9

S16 0502

.053 – .069

(1.346 – 1.752)

.014 – .019

(0.355 – 0.483)

TYP

.004 – .010

(0.101 – 0.254)

.050

(1.270)

BSC

.245

MIN

N

1

2

3

N/2

.160

±.005

RECOMMENDED SOLDER PAD LAYOUT

.045

±.005

.050 BSC

.030

±.005

TYP

INCHES

(MILLIMETERS)

NOTE:

1. DIMENSIONS IN

2. DRAWING NOT TO SCALE

3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.

MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)