LTC4264

23

4264f

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTION

DE Package

12-Lead Plastic DFN (4mm

× 3mm)

(Reference LTC DWG # 05-08-1695 Rev C)

4.00

±0.10

(2 SIDES)

3.00

±0.10

(2 SIDES)

NOTE:

1. DRAWING PROPOSED TO BE A VARIATION OF VERSION

(WGED) IN JEDEC PACKAGE OUTLINE M0-229

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

0.40

± 0.10

BOTTOM VIEW—EXPOSED PAD

1.70

± 0.05

(2 SIDES)

0.75

±0.05

R = 0.115

TYP

R = 0.05

TYP

0.25

± 0.05

3.30

±0.05

(2 SIDES)

1

6

12

7

0.50

BSC

PIN 1 NOTCH

R = 0.20 OR

0.35

× 45°

CHAMFER

PIN 1

TOP MARK

(NOTE 6)

0.200 REF

0.00 – 0.05

(UE12/DE12) DFN 0905 REV C

0.25

± 0.05

3.30

±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

1.70

±0.05

(2 SIDES)

2.20

±0.05

0.50

BSC

0.70

±0.05

3.60

±0.05

PACKAGE OUTLINE