LTC4444

6

4444f

PIN FUNCTIONS

TYPICAL PERFORMANCE CHARACTERISTICS

Switching Supply Current vs

Input Frequency

Switching Supply Current vs

Load Capacitance

TINP (Pin 1): High Side Input Signal. Input referenced

to GND. This input controls the high side driver output

(TG).

BINP (Pin 2): Low Side Input Signal. This input controls

the low side driver output (BG).

and the low side gate driver output directly and the high

side gate driver output through an external diode con-

nected between this pin and BOOST (Pin 6). A low ESR

ceramic bypass capacitor should be tied between this pin

and GND (Pin 9).

BG (Pin 4): Low Side Gate Driver Output (Bottom Gate).

NC (Pin 5): No Connect. No connection required.

BOOST (Pin 6): High Side Bootstrapped Supply. An ex-

ternal capacitor should be tied between this pin and TS

(Pin 8). Normally, a bootstrap diode is connected between

age drop of the bootstrap diode.

TG (Pin 7): High Side Gate Driver Output (Top Gate). This

pin swings between TS and BOOST.

TS (Pin 8): High Side MOSFET Source Connection (Top

Source).

Exposed Pad (Pin 9): Ground. Must be soldered to PCB

ground for optimal thermal performance.

SWITCHING FREQUENCY (kHz)

0

1.5

2.0

2.5

600

1000

4444 G18

1.0

0.5

0

200

400

800

3.0

3.5

4.0

(TG SWITCHING)

(BG SWITCHING)

(TG SWITCHING)

TS = GND

LOAD CAPACITANCE (nF)

1

10

100

1

345

0.1

27

8

9

6

10

"""" /'

(BG SWITCHING

AT 1MHz)

(TG SWITCHING

AT 500kHz)

(TG SWITCHING

AT 1MHz)

(BG SWITCHING

AT 500kHz)

(TG SWITCHING AT 500kHz)

(TG SWITCHING

AT 1MHz)