LTM4604 datasheet(15/20 Pages) LINER

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LTM4604

4604f

Safety Considerations

The LTM4604 modules do not provide isolation from VIN to

VOUT. There is no internal fuse. If required, a slow blow fuse

with a rating twice the maximum input current needs to be

provided to protect each unit from catastrophic failure.

Layout Checklist/Example

The high integration of LTM4604 makes the PCB board

layout very simple and easy. However, to optimize its electri-

cal and thermal performance, some layout considerations

are still necessary.

• Use large PCB copper areas for high current path,

including VIN, GND and VOUT. It helps to minimize the

PCB conduction loss and thermal stress.

• Place high frequency ceramic input and output capacitors

next to the VIN, GND and VOUT pins to minimize high

frequency noise.

• Place a dedicated power ground layer underneath the

unit.

• To minimize the via conduction loss and reduce module

thermal stress, use multiple vias for interconnection

between top layer and other power layers.

• Do not put vias directly on the pads unless they are

capped.

• SW pads can be soldered to board to improve thermal

performance.

Figure14 gives a good example of the recommended

layout.

Figure 15. Typical 2.375V to 5.5V Input, 1.5V at 4A Design

Figure 14. Recommended PCB Layout

•

••

••••

•

GND

4604 F14

VOUT

VIN

CIN

COUT

VIN

2.375V TO 5.5V

PGOOD

COMP

LTM4604

RUN/SS

RFB

5.69k

0.5%

COUT

μF ×3

6.3V

X5R OR X7R

REFER TO

TABLE 4

VOUT

1.5V

CIN

μF

6.3V

X5R OR X7R

OPEN-DRAIN

PULL UP

CSSEXT

0.01

μF

VOUT

TRACK

GND

4604 F15

APPLICATIONS INFORMATION

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